
20
TECHNOLOGY | 802.15.4 / SUB-GIG
20
TECHNOLOGY | ANTENNAS
20
TECHNOLOGY | BLUETOOTH
20
TECHNOLOGY | CELLULAR
20
TECHNOLOGY | GPS / GNSS MODULE
20
TECHNOLOGY | WI-FI
20
SPECIFICATIONS
Figure 3: Mechanical Specifications
BENEFITS
• Based on Qualcomm Atheros
AR6003. This game changing chip
technology enables the SX-570/
SX-580 to provide breakthrough
performance at the lowest cost.
• Linux operating system with user
programmability. The SX-570/SX-580
is uses the Linux operating system
and is designed to allow users to
easily add new features. With a
454MHz processor and 16MB of RAM
and 8MB of flash memory, the SX-
570/SX-580 has plenty of capacity to
handle complex user applications.
• Reduced power consumption. The
SX-570/SX-580 uses a minimum
amount of power during transmitting
and receiving, and its power
management reduces power usage
during periods of inactivity.
APPLICATIONS
• The SX-570/SX-580 high-
performance intelligent modules are
designed for connecting portable
devices to 802.11 wireless local area
networks (WLANs), and eliminate
the need for the development
investment of the wireless LAN driver
and security supplicant.
• They are ideal for OEM applications
that need WLAN connectivity with
minimal power usage, such as
battery-operated portable devices
for medical, printer, weights and
measures, and other applications.
ITEM SPECIFICATION UNIT NOTE
CPU
MCIMX280CVM4B (Freescale)
Clock Frequency 454MHz
Radio
SX-SDMGN (SX-570)
SX-SDMAN (SX-580)
FLASH ROM
(SPI Interface)
[Standard]
8MB S25FL064P0XNFI000 (Spansion)
[UP]
16MB S25FL128P0XNFI000
(Spansion)
SDRAM
64MB DDR2 (32M x 16bit
Clock Frequency 205MHz (maximum)
Ethernet PHY
10BASE-T 100BASE-TX
LAN8720Ai-CP (SMSC)
Interface
(SX-570) IEEE802.11 b/g/n/e/i
(SX-580) IEEE802.11 a/b/g/n/e/h/i
Bluetooth 3.0 (unsupported to
3.0+HS)
USB 2.0 OTG×1
USB 2.0 Host×1
Ethernet 10/100×1
UART ×3
1 port: CTS/RTS flow
2 port: No flow control
SPI×1
I2C×1
Connector Type 50-pins connector HIROSE : DF12-50DS-0.5V(86)
Antenna Connector
(SX-570 SX-580)
U.FL Alternative Connector x 2
Weight
SX-570 9
SX-580 10
g
Dimension 55×30 mm
W x H , PCB Thickness =
1.0mm.
MTBF 90,000 h
DOWNLOADABLE EXTRAS
• Product Brief
• Developers Reference and User
Manual
• Console Command Line Interface
Documentation
To download these resources please visit
http://fcs.futureelectronics.com/
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