
AppendixC–EnvironmentalInformation
24 Multi‐TechSystems,Inc.MultiModemCellUserGuide
Multi‐TechSystems,Inc.alsodeclaresithasbeendulydiligentinensuringthattheproductssuppliedare
compliantthroughaformalizedprocesswhichincludescollectionandvalidationofmaterialsdeclarationsand
selectivematerialsanalysiswhereappropriate.Thisdataiscontrolledasapartofaformalqualitysystemand
willbemadeavailableupo
nrequest.
RestrictionoftheUseofHazardousSubstances(RoHS)
Multi‐TechSystems,Inc.
CertificateofCompliance
2002/95/EC
Multi‐TechSystems,Inc.confirmsthatthisproductnowcomplieswiththechemicalconcentrationlimitations
setforthinthedirective2002/95/ECoftheEuropeanParliament(RestrictionOftheuseofcertainHa zardous
Substancesinelectricalandelectronicequipment‐RoHS)
TheseMulti‐TechSyste
ms,Inc.productsdonotcontainthefollowingbannedchemicals:
Lead,[Pb]<1000PPM
Mercury,[Hg]<1000PPM
HexavalentChromium,[Cr+6]<1000PPM
Cadmium,[Cd]<100PPM
PolybrominatedBiphenyl,[PBB]<1000PPM
PolybrominatedDiphenylEther,[PBDE]<1000PPM
MoistureSensitivityLevel(MSL)=1
MaximumSolderingte
mperature=260C(waveonly)
Notes:
1. LeadusageinsomecomponentsisexemptedbythefollowingRoHSannex;therefore,higherlead
concentrationcouldbefound.
a. Leadinhighmeltingtem peraturetypesolders(thatis,tin‐leadsolderalloyscontainingmorethan85%
lead).
b. Leadinelectronicceramicparts(forexample,piezoelectronicdevices).
2. MoistureSensitivityLevel(MSL)–Analysisisbasedonthecomponents/materia l usedontheboard.
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